Here is the abstract you requested from the Thermal_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Advanced Liquid Cooling Design and Performance|
|Keywords: Liquid Cooling, Heat Flux , Thermoelectric Coolers|
|The level of interest in the industry for higher performance cooling technologies has intensified with the increasing heat flux of recent semiconductor trends. It would seem that the only real limiting factor for the heat that will be produced in a high performance PC is the amount of power that can be extracted from a household electrical outlet. Given this fact, it has become necessary to consider all options to ensure stable operating temperatures for high performance CPUs and GPUs. This presentation outlines the design issues with state-of-the-art closed loop microchannel liquid cooling solutions with an option to combine with the efficient implementation of thermoelectric chilling. This presentation incorporates the description of problems encountered when using thermoelectric coolers directly in contact with the semiconductor chips like CPU’s or GPUs and an alternative method where recirculated liquid medium is used to disperse the heat load over a much larger surface area and avoid high heat flux on the hot side of the thermoelectric cooler. In the presentation, the range of system level thermal resistance achievable with liquid cooling will be shown with and without the implementation of thermoelectric coolers. The commercial implementation of liquid TEC solutions can achieve COP of 3 or more. This technology will further extend the total amount of heat a liquid system can dissipate providing a practical cooling option without resorting to high pressure phase change technologies.|
|Mr. Geoff Lyon, CEO
CoolIT Systems Inc.
CALGARY, AB T1Y 6B6,