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Advanced Liquid Cooling Design and Performance
Keywords: Liquid Cooling, Heat Flux , Thermoelectric Coolers
The level of interest in the industry for higher performance cooling technologies has intensified with the increasing heat flux of recent semiconductor trends. It would seem that the only real limiting factor for the heat that will be produced in a high performance PC is the amount of power that can be extracted from a household electrical outlet. Given this fact, it has become necessary to consider all options to ensure stable operating temperatures for high performance CPUs and GPUs. This presentation outlines the design issues with state-of-the-art closed loop microchannel liquid cooling solutions with an option to combine with the efficient implementation of thermoelectric chilling. This presentation incorporates the description of problems encountered when using thermoelectric coolers directly in contact with the semiconductor chips like CPUs or GPUs and an alternative method where recirculated liquid medium is used to disperse the heat load over a much larger surface area and avoid high heat flux on the hot side of the thermoelectric cooler. In the presentation, the range of system level thermal resistance achievable with liquid cooling will be shown with and without the implementation of thermoelectric coolers. The commercial implementation of liquid TEC solutions can achieve COP of 3 or more. This technology will further extend the total amount of heat a liquid system can dissipate providing a practical cooling option without resorting to high pressure phase change technologies.
Mr. Geoff Lyon, CEO
CoolIT Systems Inc.

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