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|Multiscale Thermal Modeling of Electronics Cabinets|
|Keywords: multiscale, reduced order modeling, electronics cabinet|
|The characterization and design of complex thermal fluid systems such as electronic cabinets requires attention to a broad range of length scales and physical phenomena, ranging from heat conduction at the chip package level to heat convection at rack level. Detailed numerical calculations or experimental measurements are often time consuming and computationally expensive. This work describes an efficient strategy to bridge length scales by developing separate models for various system components and assembling them to model the full system. A reduced order model for each subsystem, such as sever, intake plenum and exhaust plenum, is developed using proper orthogonal decomposition and is modularized in the library of design. The modeling of system is obtained through interconnecting those modules for each component in the system. This procedure is extended to capture the thermal performance at the package level by utilizing the compact package model in the development of reduced order model at the server level. The thermal information from the reduced order model at the sever level is extracted and used as boundary conditions for the detailed package level simulation. A simulation from the package level to the cabinet level is conducted through this methodology, demonstrating that the computational cost is reduced by five orders of magnitude. The approximation error of reduced order modeling is less than 10% at different levels, compared to the detailed computational fluid dynamics and heat transfer simulations, and experiments conducted on a prototype cabinet.|
|Qihong Nie, Ph.D. Candidate/Graduate Reserach Assistant
Georgia Institute of Technology