Here is the abstract you requested from the IMAPS_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Engineering Considerations for Fabrications of Multiple-Submicro-Layer Clad Metals|
|Keywords: clad metal, sub-micro, process|
|Clad metal is a layered metallic composite used in different applications. As the layer number increases and the layer thickness decreases, a clad metal may provide special functions, which might be required by electronic packaging. This paper describes engineering considerations of designs and fabrication processes for multiple—submicro-layer clad metals. Originally sent to MEMS and Sensors, then to Poster, then to Advanced Materials.|
|L. Leigh Chen, Manager, Engineering Development
Technical Materials, Inc