Here is the abstract you requested from the IMAPS_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Corrosion Resistant Anisotropic Conductive Adhesive for Consumer Electronic Application|
|Keywords: anisotropic conductive adhesive, corrosion resistant, non noble metal|
|Today resin based interconnection materials for flip chip technologies are widely used in manufacturing electronic devices such as flat panel displays and other semiconductor package modules in form of chip on glass (COG) and chip on flex (COF) for last few decades. Traditionally these applications were done using anisotropic conductive film (ACF) which provides Pb-free assembly however it requires additional steps of handling and laminating the film on the substrate prior to bonding the chip down. The proliferation of the flip chip technology is evident in many consumer electronic applications like RFID and mobile phones where the high throughput rate and lower processing temperature is critical. For many of these emerging applications the traditional ACA (mainly ACF) may not be suitable with regard to cure speed and the compatibility with non noble metallization and there is a need for low temperature, snap cure anisotropic conductive paste (ACP) which can be dispensed, jetted or printed on the substrate prior to the assembly. In this paper, a novel anisotropic conductive paste (ACP) will be discussed which was formulated and optimized through mixture DOE methods. The paper will also discuss the effects of different bonding parameters, such as temperature, pressure, curing time studied and optimized through factorial DOE methods. The paper will discuss the jettability, stencil and screen printing characteristics of this novel ACP which was performed over its long work life. The contact resistance and adhesion strength stability of the ACP to non-noble metal (Cu, Al) in 85¡ãC/85% RH for greater than 250 hrs and 500 hrs thermal shock cycles will be discussed. Originally sent to Underfill, Encapsulants and Adhesives.|
|Bo Xia, Associate
Emerson & Cuming