Abstract Preview

Here is the abstract you requested from the IMAPS_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Keywords: Single Device Tracking SDT, Semi E142, Strip Mapping
There has been much talk about Single Device Tracking (SDT) and now there is the SEMI E142 standard that provides the necessary framework to make it possible, but one big question remains. Does it justify the significant investment involved? Several independent device manufacturers (IDMs) have already made the qualitative assessment that SDT will be required in the future and have initiated programs that include it in their roadmap. We will look at the quantitative cost/benefit analysis that these IDMs, as well as IC packaging foundries, must make before allocating the funds to make SDT a reality. On the cost side, the equipment vendors play a significant role, so we will also look at the commercial aspects of implementing SDT from their point of view. On the benefit side, we will look at three distinct areas; 1) Saving manufacturing cost, 2) New product development, 3) Mitigating the cost of field failure. Ultimately, the realization of SDT will be the result of a partnership between the end user, the equipment vendor and the software and integration services providers.
Mr. Lonny Plummer, VP Sales and Business Development
Kinesys Software Inc.
Petaluma, CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic