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Optimization of Probing Needle Design for Wafer-Level Probing Test
Keywords: Wafer-level probing test, Finite element analysis, Optimization
The probing test is a typical quality control method for individual chips on a wafer. With a proper design, the service life of probing needles in the probe card can be sufficiently elongated and hence reduces the testing cost. In this work, we followed the Taguchi method with the L18 (2^1x3^7) orthogonal array to obtain an optimal geometrical design of the probing needle based on the minimization of the scrub length the probe tip travels during a wafer-level probing test procedure. Geometrical factors of the needle included tip shape, needle diameter, beam length, taper length, knee diameter, shooting angle, tip length, and tip diameter. Importance of theses factors on the scrub length was also ranked.
Yi-Shao Lai, Deputy Director
Advanced Semiconductor Engineering, Inc.
Kaohsiung 81170,

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