Here is the abstract you requested from the IMAPS_2008b technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Board Level Reliability Testing of High-Rel Microprocessorsassociated to RoHS Packaging Solutions|
|Keywords: Board Level Reliability, Lead Free, High Performance Packaging|
|With over twenty five years experience in manufacturing High-Reliability products, e2v semiconductors has reached worldwide renowned recognition for supplying microprocessors for severe environments applications. e2v has been successfully moving forward through the lead-free transition and looking to the future of microelectronics packaging technologies for its extended-reliability products. By achieving the requirements of today’s highest level of reliability, e2v keeps offering products dedicated to serve High-Rel applications such as avionics, military and space. In 2007/2008, e2v semiconductors has conducted a new study into board level reliability and obtained results exhibiting very good performance of HITCE material associated to leadfree solder joints under harsh environmental conditions. e2v’s presentation will compare the behavior of high lead interconnections with that of RoHS-compliant packaging solutions for its Hi-Rel Microprocessors products. In particular, the presentation will highlight the reliability testing results for the Hi-TCE Ceramic Ball Grid Array (HITCE CBGA) technology when soldered on FR4 printed circuit boards and submitted to temperature cyclings between -40°C and +125°C.|
|Olivier Gaillard, Packaging Development Engineer
Saint Egrève Cedex 38521,