Here is the abstract you requested from the IMAPS_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|High Temperature Resistance Conductive Film for RF Grounding Application|
|Keywords: High temperature resistance, conductive film, RF grounding|
|In current defense industry, there is an increasing demand on high temperature resistance material in many applications. Conductive film adhesives have been widely used for RF grounding assembly applications. They offer unique features such as consistent and void-free bondline, lower temperature processing, excellent electrical conduction and high reliable RF ground plane performance. Traditional conductive films however lose their adhesion strength dramatically when exposed to higher temperatures. This makes them not ideal for high temperature applications. Due to this there was a need in the marketplace to develop a high temperature resistance conductive film to meet these new high temperature requirements and allow T/R modules to operate at high frequency. This paper examines the latest generation of conductive film. It will describe a newly developed high temperature resistance conductive film that offers good adhesion at elevated temperature. The film’s ability to maintain good adhesion at elevated temperature will be compared to two conventional conductive films. The results reveal the newly developed high temperature film has effective grounding capability, suitable processing conditions and excellent adhesion performance at high temperatures. The paper will also compare and contrast the cure kinetics, rheology and modulus of the novel high temperature film with traditional conductive film.|
|Jing Fan, Development Associate
Emerson & Cuming