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Heavy Aluminum Wire Wedge Bonding on LTCC Substrate for Automotive Electronics
Keywords: Aluminum wedge bonding, LTCC, Automotive electronics
This paper will discuss the substrate and package design issues that should be considered when developing a ultrasonically heavy aluminum wire wedge bonding process which are widely used for electrical and signal/power interconnections of automotive electronics. With electronic packages getting denser and thermal management more critical, wire bonding that is one of the main form of interconnections of die to substrate and substrate to DBC/housing should have higher reliability characteristics. The present work is an investigation concerning the effect of bond pad of substrate and metal finishing on the bondability of ultrasonic aluminum wedge bonding, as well as the effect of wire and bonding parameters. Firstly, it was found that the thickness and roughness of the base metal (Ag surface conductor) of low temperature co-fired ceramics (LTCC) substrate played a critical role on bondability. And secondly, the surface metal finishing which is electroless Ni/Pd/Au plating (ENEPIG) system is superior to that of electroless Ni/Au (ENIG) plating. Furthermore, conventional factors which are ultrasonic power, force and Al wire etc. are briefly reviewed in a viewpoint of bondability and reliability on LTCC system
Je-Hong Sung,
Samsung Electro-Mechanics
Suwon, Gyunggi-Do 443-743,

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