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Thermal Aging of Laminate Materials and the Maximum Use Temperature of Organic Packages
Keywords: Organic laminate, Thermal aging, Solder mask
Organic substrates are the low cost option for chip packaging. As chips increase in power consumption the temperatures experienced by the laminates, especially near chip “hot spots”, continue to increase particularly in high end applications. Further, decreases in wiring dimensions within the package lead to increases in resistive joule heating in the laminates. Both of these factors lead to increased continuous use temperatures for organic packages. Properties of commercial laminate materials are reported for samples that underwent standard manufacturing processing. Over the life of the package, however, these properties are likely to change due to thermal aging which can impact the ultimate lifetime and performance of the package. It is well known that organic materials are sensitive to thermal degradation at elevated temperatures. Thus a critical question for the determination of the maximum use temperature of an organic package is how much heat the materials can withstand and for how long a period of time without impacting the performance and reliability. Since several materials are employed in organic packages, it is important to understand the thermal aging of each material and their likely failure mechanisms. In this paper we will report our studies on the effect of thermal treatment on a variety of commercially available soldermasks and build-up materials. The impact of time, temperature, and atmosphere were investigated. The bulk thermal stability and degradation products, as well as changes in spectroscopic and mechanical properties were evaluated. Significant differences in the thermal degradation of various soldermasks were observed, while differences in aging of build-up materials were less pronounced. The presence of oxygen during thermal treatment had a significant impact on the rate of change of the material properties.
Laura L. Kosbar, Research Staff Member
IBM T.J. Watson Research Center
Yorktown Heights, NY
USA


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