Here is the abstract you requested from the IMAPS_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Use of High Dk, Low Loss Composite Material as use for Embedded Capacitors in High Frequency Applications|
|Keywords: passives, embedded, capacitors|
|In order to meet the never ending desire for smaller and cheaper electronics, many companies are pursuing the use of embedded passive technologies. There are several examples of embedded capacitors, especially for digital functions such as decoupling. Up to this point however, it has been more difficult to use embedded capacitors as part of RF circuitry such as filters. This is due to the fact that most materials used for forming embedded discrete capacitors have relatively high loss at GHz frequencies. Also, the capacitance density can change as a function of frequency and temperature and effect the performance. New materials have been developed to address the loss and capacitance variation of the typical embedded capacitor materials. The paper will show a comparison of the new versus existing materials used for embedded capacitors and demonstrate a lower temperature coefficient of capacitance (TCC), lower loss at frequencies up to 10 GHz and stable capacitance density to 10 GHz. In addition, several manufacturing techniques will be show to incorporate this material into an organic chip package, as well as ways to minimize the variation of the electrode areas to improve total tolerance. In summary this paper will show a path for those who are designing RF modules on LTCC (due to stable performance) a way to reduce cost by going to organic packages and incorporating embedded capacitor materials.|
|John Andresakis, VP of Strategic Technology
Oak-Mitsui Technologies, LLC
Hoosick Falls, NY