Micross

Abstract Preview

Here is the abstract you requested from the IMAPS_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

High Speed Dispensing Solutions for Packaging and Manufacturing
Keywords: Dispensing, High speed, Packaging
Packaging is one the key components for manufacturing of compact functional devices. Screen printing has been an important process for patterning a number of electronic devices however, as the critical dimensions continue to shrink, this technology has been challenged by its accuracy and dimensionality. In order to solve this problem while keeping high productivity, nScrypt Inc. has developed high speed dispensing technology for packaging, conductive lines, resistors and dielectric insulators. As a through nozzle dispensing technology, the nozzle (tip) has been optimized to a conical shape which reduces the pressure that is need to extrude the material (typically paste) through the opening, thus enabling speed. This technology can handle material from very low viscosities up to several million centipoises. A number of materials have been dispensed at several hundred mm/second, which qualifies it as high speed dispensing. To further enhance the speed, parallel dispensing has also been demonstrated. A height sensor, normally a laser based sensor, is employed to acquire the z data for conformal and 3D surface, so that conformal and 3D dispensing is made possible. A novel pumping technology, which employs a special needle valve mechanism to control flow on and off couples with the high speed to ensure material is accurately placed in an x, y, z map. The needle valve technology enables pico-liter control in the dispense process. Micro resolution x, y and z stages are integrated to the system, which enables the precise of placement. In the paper, dispensed micro dots, lines and patterns will be presented. In addition, 3D printing and high speed dispensing will be presented. This technology has various applications, including but not limited to, electronic packaging, manufacturing, solar industry, biomedical applications, electro optical applications and next generation hybrids.
Bo Li, Development Engineer
nScrypt Inc.
Orlando, FL
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems