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Effect of Thermal Contact Conductance and Bond Line Thickness on Thermal Measurement Condition of Thermal Interface Material Tester
Keywords: thermal interface material, thermal contact conductance, bond line thickness
We demonstrate in this paper the thermal analysis incorporated with contact methodology on the thermal measurement condition of thermal interface material (TIM) tester. The thermal measurement condition can easily infer through analytical solutions. Verification between analytical and finite element analysis (FEA) is perfectly matched. This verified FEA is thus studied on the thermal performance of TCCs and BLTs on specific conditions. Both increasing thermal contact conductance (TCC) and bond line thickness (BLT) have had great influence up to 43 % temperature reduction and 33% temperature increase compared to the lowest magnitude. On the other hand, for the sake of enhancing the thermal performance, TCC and BLT should be increased and decreased, respectively. For the nature of soft and low thermal performance as available TIM behaved, a pressure is inevitable to apply on it. The pressure-dependent pump-out and TCC is therefore required to involve through a coupled-field thermal-mechanical analysis.
Yi-Shao Lai, Deputy Director
Advanced Semiconductor Engineering, Inc.
Kaohsiung 81170,

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