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A New Idea to Manufacture High Density Packaging Substrate
Keywords: packaging substrate, routing density, foldable substrate
In the roadmap of electronic packaging, high routing density and low economical manufacturing cost are two important goals. Unfortunately, these two goals are not easy to be simultaneously achieved. A new idea to manufacture high density packaging substrate was introduced in this paper. By using temporary carrier in our manufacturing process, a high precision alignment and extremely thin dielectric layer can be processed. We use this process to manufacture high density packaging substrates. This kind of substrates has high routing density and light weight. Furthermore, this kind of substrates is also provided with flexible and foldable properties because of its extremely thin thickness. A series of data show the performance of this substrate: 45um via pitch, 15um/15um line/space and 11um layer to layer thickness. According to these data, the routing density is highly increased, and this property can made substrates more economical to meet the technical roadmap. For example, a Flip-chip substrate with 3 rows of bump pads fan-out can be completed in only 1 routing layer instead of 2 or 3 layers. The materials and process steps are decreased. Therefore, it is a good idea to achieve low cost packaging by increasing routing density of substrate. Moreover, a 4-chips SIP system prototype is also made to demonstrate this technology. This SIP system uses a 6-layers high density substrate and the thickness of this substrate is only 74 um. This substrate totally has 4369 pin counts and the packaging area is only 33mm*33mm. In addition, decreasing thickness gives another benefit to packaging substrate. A foldable system can be realized by this thin substrate. Based on the common design rule of flexible substrates, the bending radius of curvature is 10 times of the thickness of substrates. We also demonstrate foldable property of this substrate.
Chih Kuang Yang, Project Manager
Princo Corp.
Hsinchu, Taiwan 300,

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