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Inkjet Printed Interconnections on Flexible Substrates
Keywords: inkjet, flexible substrates, reliability
Utilization of inkjet printing as a manufacturing method of electronics has been studied at Tampere University of Technology. Use of additive manufacturing methods is to be presented with a technology demonstrator which will be manufactured mainly by using inkjet printing. In order to successfully integrate additive manufacturing with traditional electronics components, mutual functional interfaces must be evaluated. One of these interfaces is the joint between discrete components and inkjet printed conductive traces. In this study discrete passive components were joined to conductive traces that are inkjet printed with metallo-organic nano silver ink on flexible substrates such as polyimide foil and PEN. Discrete passive components were attached using isotropic conductive adhesive. Standard temperature cycling tests set by JEDEC and thermal shock tests were done to these manufactured samples. There is a lack of available information about the reliability of inkjet printed interconnections and this is why accelerated reliability testing was selected as the test method. This also gives information about failure mechanisms of printed interconnections which is very critical in terms of overall reliability. In addition, the reliability of the interconnections is directly related, in terms of yield and operating life, to environmental load of the final product. Study started with screening of suitable substrate materials and ink. Important drivers were the optimization of electrical performance as well as minimizing cost and environmental impacts since the final product is considered to be mass produced. In this paper the results of the reliability of inkjet printed interconnections are presented as well as its contribution to material selection of the final product.
Esa Kunnari, Researcher
Tampere University of Technology
Tampere 33720,

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