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Temporary Wafer Bonding Material Used at High Temperature
Keywords: 3D packaging, wafer bond, adhesive
Three-dimensional integration is a very promising technology with a potential to improve device performance, increase device functionality, reduce power consumption, and decrease the device size. One of the challenges in 3D integration is processing the thinned wafer at high temperatures and in chemically stringent environments while the thinned wafer is still supported on a carrier wafer with temporary bonding material. Brewer Science has developed a new high-temperature spin-on material for temporary wafer bonding that satisfies the requirements of backside processes such as Cu-Cu thermo compression and polyimide curing that are typically performed at temperatures above 300°C. In addition to its high-temperature stability, this material enables debonding from the carrier wafer by a “slide-off” mechanism to eliminate risk of wafer breakage. This paper discusses pertinent properties of this material, such as high coating and bonding uniformity, short debonding time, and ease of removal with industry-accepted safe solvents and the processes developed to achieve these properties.
Dongshun Bai, Applications Engineer
Brewer Science, Inc.
Rolla, MO

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