Micross

Abstract Preview

Here is the abstract you requested from the IMAPS_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Effect of Elevated Currents on Contact Resistance of Stamped Metal Land Grid Array (LGA) Sockets
Keywords: land grid array, stamped metal socket, current
In recent years the numbers of cores in a microprocessor has been increasing, placing demands for increased current carrying capability on the interconnect. As greater currents pass through the interconnect, Joule heating is expected to cause a temperature rise accelerating failure mechanisms such as stress relaxation in connectors. The goal of this study is to evaluate the effect of elevated currents above the rated current on the stress relaxation and contact resistance of stamped metal land grid array (LGA) sockets. By measuring the contact resistance in-situ during a stress relaxation test failures induced by elevated current can be monitored. Therefore a methodology for uprating current in stamped metal LGA sockets is presented that is tied to the failure criterion and not merely a temperature rise.
Vidyu Challa,
University of Maryland
College Park, MD
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems