Abstract Preview

Here is the abstract you requested from the IMAPS_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Optical Approach to NDT of MEMS
Keywords: MEMS, quantitative measurements, reliability
Recent advances in optoelectronic methodology for micro-scale measurements are described and their use is illustrated with representative examples of microelectromechanical systems (MEMS) operating at high frequencies and used in demanding environments. Advances in emerging technologies of MEMS, especially relating to their applications, constitute one of the most challenging tasks in today’s micromechanics. In addition to design, analysis, and fabrication capabilities, this task also requires advanced test methodologies for determination of functional characteristics of the devices produced to enable verification of their operation as well as refinement and optimization of the specific designs. In particular, development of miniscule devices requires sophisticated tools. These tools can be categorized as analytical, computational, and experimental. Solutions using the tools from any one category alone do not usually provide all of the necessary information on MEMS and extensive merging, or hybridization, of the tools from different categories is used. One of the approaches employed in this development of structures of contemporary interest, is based on a combined use of the analytical, computational, and experimental solutions (ACES) methodology. Development of this methodology was made possible by recent advances in an optical NDT method, which was coupled with the state-of-the-art (SOTA) computational methods, to offer a considerable promise for effective development of various designs. This approach facilitates characterization of dynamic and thermomechanical behavior of the individual components, their packages, and other complex material structures. Using representative MEMS samples, deformations were measured from nanometers to a few hundred ìm, depending on the specific operating conditions and nature of the MEMS considered. Experimental results correlated with theoretical results well within the criteria specified by the uncertainty analysis. Validated correlations will lead to establishment of “design by analysis” methodology for efficient and effective developments of structures, which is becoming necessary as consequences of MEMS reliability assessment (MRA) are being resolved.
Ryszard J. Pryputniewicz, Professor and Director, ME/CHSLT-NEST
Worcester Polytechnic Institute
Worcester, MA

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems