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Here is the abstract you requested from the IMAPS_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Enabling of Off-the-Shelf IC for Parallel Stochastic Self-Assembly
Keywords: Fluidic Self Assembly, RF Micro Sensor, off-the shelf-component
The objective of this study and process development was to enable the fabrication of IC chips for fluidic self assembly (FSA) using components-off-the-shelf (COtS). Previously only custom designed IC chips have been used in FSA. A commercially available memory chip with rectangular form containing 8 I/O pads was used to test the concept in a RF micro sensor application. The chips were obtained in wafer form and the I/O pads were relocated into symmetrically arrangement by adding a redistribution layer (RDL) with vias to the original pads. A chip with simple shape, such as rectangle or square and symmetrically arranged pads will increase the FSA yield while fully utilizing the economical benefits of the process; the chip orientation in the receptor site becomes irrelevant while its unique size and shape ensures that is falls in the correct place. Otherwise, with multiple I/O pads the correct orientation in the receptor site for each individual chip need to be known if conventional interconnect methods would be used. This paper presents the design steps, processes, and materials used in the fabrication of redistribution layer for off-the-shelf IC components.
Bernd Scholz,
North Dakota State University - Center f. Nanoscale Sciece & Engineering
Fargo, ND
USA


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