Abstract Preview

Here is the abstract you requested from the IMAPS_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Processing and Reliability Issues for Eutectic AuSn Solder Joints
Keywords: AuSn, reliability, processing
Eutectic AuSn solder is increasingly used in high reliability and/or high temperature applications where conventional SnPb and Pb-free solders exhibit excessive deformation, insufficient strength, and/or creep resistance. These include hybrid microelectronics, MEMS, and laser diode packaging for industrial, military, and telecommunications applications. However, the materials and processing considerations are substantially different than conventional solders, and many companies struggle with issues such as poor solder flow, excessive void formation, variable reflow temperature (arising from off-eutectic compositions), heterogeneous phase distribution, and others, all contributing to process yield loss and early field failures. This paper reviews the critical issues in material, equipment, and process selection. Furthermore, the advantages and disadvantages of existing analytical & numerical models as well as accelerated testing methodologies are discussed with respect to accurately predicting field performance under a variety of conditions.
J.C. McNulty, Director of East Asian Business Development and Senior Member of Technical Staff
DfR Solutions, LLC
College Park, MD

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic