Micross

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Embedded Capacitance for Noise Reduction and EMI Reduction in High Speed Digital and RF Designs
Keywords: Embedded Capacitance, Power Supply Decoupling, Noise Reduction
The presentation will cover many advantages of ultra-thin embedded passives materials in rigid and flexible printed circuit boards/chip packaging in high speed digital and RF applications. A large amount of electrical performance, discrete capacitor elimination data and reliability data will be shared that was conducted by independent OEMs, universities and PCB fabricators. It will be shown that when ultra-thin embedded capacitor materials are used for distributed capacitance (power-ground cores) for power supply decoupling the following advantages will result: *Lowered impedance of power distribution system *Dampening of board resonances *Reduced noise on power and ground planes *Reduced radiated emissions (EMI) *Elimination of large number of discrete decoupling capacitors *Reduced assembly costs *Reduction in board size and/or the number of layers All of these items can be accomplished with an ultra-thin ceramic filled epoxy material that is compatible with standard FR-4 processing including laser drilling. Additionally, this material has UL recognition, is RoHS compliant, does not contain bromine and is compatible with lead free assembly. This material is not only being used in numerous high speed digital applications but is also being used in very high volume RF applications, including cell phones. In 2007, over 100 million cell phones will be manufactured using this ultra-thin, ceramic filled epoxy material manufactured by 3M. The driver for this application is space reduction and improved RF filtering. In this application, over 50 discrete capacitors per square inch were removed and RF noise was reduced by over 30 dB.
Joel S. Peiffer, Advanced Engineering Specialist
3M
St. Paul, MN
USA


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