Here is the abstract you requested from the IMAPS_2008d technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Understanding Behavior of Liquid Crystal Polymer (LCP) in Laser Assisted Bonding (LAB) for Wafer-Level Packaging of MEMS and Related Microsystems|
|Keywords: liquid crystal polymer, laser assisted bonding, wafer-level packaging of MEMS|
|Substrate-to-substrate bonding, device cavity and through wafer via interconnections are critical needs for wafer-level (WL) packaging of MEMS and related microsystems. In particular, LCP presents a unique choice for WL packaging of RFMEMS devices due to good RF performance, low absorption of moisture and low cost. LCP cap wafer to device carrier wafer (such as silicon and glass) bonding is an integral step in WL packaging for RFMEMS devices. Various substrate-to-substrate bonding techniques are of choice, and laser presents a unique opportunity due to region selectivity, controlled energy deposition, and fast manufacturing speed in a scaled up manufacturing process. It is important to study modification(s) to LCP, particularly structural, surface and electrical as a result of LAB processing. This paper will present findings of IR laser processing of LCP for bonding through a set of analytical approaches namely optical and electron microscopies, FTIR and Raman spectroscopies, hermetic and sealing performance, bond shear strength and scanning acoustic imaging, and RF properties. The manuscript will also discuss temperature profile and the stress distributions at the LCP-device wafer interface. Success of this process will present opportunities in low cost RF MEMS packaging for large scale production for wireless and related communication applications.|
|Ujjwala Darvemula, Student
University of Arkansas