Here is the abstract you requested from the IMAPS_2008d technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Nano Electro Machining (nanoEM): A Novel Method for Sculpting Nano Vias (<20 nm) for Nanopackaging|
|Keywords: nanopackaging, nano electro machining, sculpting nano vias|
|Though word “nano packaging” may carry different meaning to different scientific and engineering communities, one reality is clear that the progress in novel nanoscale devices fabricated from a range of materials including metallic nanoparticles, DNA, quantum dots, carbon nano tubes, silicon nano wires, etc. is rapid. This rapid growth in device area needs to be coupled with immediate attention in the area of packaging of nanoscale devices. Packaging of such heterogeneous nano devices desire new class of nano interconnects and related inventions in fabrication processes to realize signal carrying pathways such as vias at nanoscale (<100 nm). Fabrication of nanoscale vias seek processes such as nanoscale sculpting of various materials. This manuscript will discuss a new process, nano electro machining (nanoEM) that investigators have developed to sculpt vias those are <20 nm in diameter using a probe based manufacturing. The process uses atomically sharp metallic probes and at the interface of probe-molecular medium-substrate machining is performed to sculpt material in a controlled manner. In many ways, this process is similar to its micro and macro counterparts, electric discharge machining (EDM). The process could be coupled to a computer aided design (CAD) platform and could be scaled up for the fabrication of array of vias. The paper will discuss basic principle of nanoEM, vias machining results and related fundamental science and engineering issues.|
|Ajay P. Malshe, Professor
University of Arkansas