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3 Steps to Successful Solder Paste Selection
Keywords: Solder, RoHS, Selection
Choosing a solder paste can make or break an assembly process. By choosing the right solder paste for the application, you will achieve the highest process consistency and solder joint quality. This paper covers the most significant issues in solder paste selection to meet the goals of manufacturing. The goals of any assembly operation are to maximize both quality and throughput while controlling costs. Quality is maximized by choosing a product that has the best performance with the materials, geometry and heating processes used to manufacture a product. Throughput is maximized by picking a solder product that accommodates the optimal deposition and heating methods. Cost of production is a complex calculation that includes material, direct labor, inspection, rework, and scrap value. Quality and throughput play key roles in cost control. Not all solder products are created equal, even if they seem the same according to their classification. Specialty solder pastes provide enhanced performance over off the shelf products. There are differences in wetting characteristics, void control, flux residue, alloy strength, alloy flexibility, and other performance measures that can all play significant rolls in achieving quality, throughput, and cost goals. The key is to identify the solder product that best accommodates the processes required to meet these goals.
John Vivari, Application Engineering Supervisor
EFD Inc.
Lincoln, RI

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