Here is the abstract you requested from the IMAPS_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Response Surface Analysis and its Use to Predict LTCC Firing Shrinkage for RF Microelectronics|
|Keywords: LTCC, DOE, Process|
|The Low Temperature Cofire Ceramic (LTCC) technology is used in a variety of applications including military/space electronics, wireless communication, MEMS, medical and automotive electronics. The use of LTCC is growing due to the low cost of investment, short development time, good electrical and mechanical properties, high reliability, and flexibility in design integration (3 dimensional (3D) microstructures with cavities are possible)). The dimensional accuracy of the resulting x/y shrinkage of LTCC substrates is responsible for component assembly problems with the tolerance effect that increases in relation to the substrate size. Response Surface Analysis was used to predict product shrinkage based on specific process inputs (metal loading, layer count, lamination pressure and tape thickness) with the ultimate goal to optimize manufacturing outputs (NC files, stencils and screens) in achieving the final product design the first time. Three regression models were developed for the DuPont 951 tape system with gold metallization based on green tape thickness.|
|Michael Girardi, Engineer
Honeywell Federal Manufacturing and Technology
Kansas City, MO