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Systematical Pull and Shear Test Investigations on very Small Bond Loops (Wire ≤ 25 µm) and Innovative Alloys
Keywords: wire bonding, pull test, shear test
Driven by the rapid development of the semiconductor industry and future product generations there are demanding challenges for packaging of electronic components and systems in terms of miniaturization, reliability and production costs. Besides developing adapted technologies and materials this also calls for completely new packaging and testing concepts. For wire bonding - still the dominating interconnection technology for semiconductors – this means the application of bond wires as thin as 15 µm or ribbons as low as 12.5 µm often of specially doped or alloyed materials. These material versions with higher mechanical stability partially compensate for the decreased tensile strength of thinner and thinner wires and there-fore also allow extreme loop geometries (very low, short, long loops) during miniaturization. This leads to the question, whether the guidelines for assessing the quality in terms of visual evalua-tions and mechanical tests that were developed in the middle of the 70´s (in USA: MIL-STD-883) resp. concretized in germany in the 90´s (DVS Guidelines 2811) for wires with diameter  25 µm are still valid today. For instance, with the new high strength Au wires the mixed shear code “partially crack in chip metallization, in the ball and at the interface”, which is not even men-tioned in old guidelines, may be a sign of good quality in the case of high enough shear forces. The presented results contain systematic pull and shear test analyses on thin wire bond connec-tions and give recommendations for a revision of the DVS Guidelines 2811 (from 1996).
Martin Schneider-Ramelow, Scientist, Head of Department SIIT
Fraunhofer Institute for Reliability and Microintegration (IZM)
Berlin 12047,

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