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Thermoplastic Based Solutions for Microelectronics Packaging and Components
Keywords: molded plastic optics, thermoplastics for packaging, micro features in thermoplastic
Thermoplastic injection molding is a technology that has yet to be fully utilized by the microelectronics packaging industry. Thermoplastic components have been used in opto-electronics packaging for years, namely in high volume telecommunications devices such as fiber optic transceivers. We have shown in the past that some engineered thermoplastic resins allow for producing micro-features into small parts, while maintaining micron-level tolerances. This is a requirement in many fiber optic devices. Most radio frequency modules would benefit from using thermoplastic for packaging, however a common problem with plastic is its lack of conductivity for shielding. We have demonstrated that metal coatings can be applied to plastic as a means of providing necessary shielding for EMI/RFI. We have made several key acquisitions and facility upgrades to improve our capability to deliver thermoplastic-based solutions to packaging-related problems typically associated with high cost, high weight materials such as glass, ceramic and kovar. In this paper we present a variety of examples of manufacturing methods common to the injection molding industry, but found within one technology company that has serviced the microelectronics packaging industry for years.
Scot MacGillivray, Business Development Manager
Matrix Incorporated
East Providence, RI

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