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|Thermoplastic Based Solutions for Microelectronics Packaging and Components|
|Keywords: molded plastic optics, thermoplastics for packaging, micro features in thermoplastic|
|Thermoplastic injection molding is a technology that has yet to be fully utilized by the microelectronics packaging industry. Thermoplastic components have been used in opto-electronics packaging for years, namely in high volume telecommunications devices such as fiber optic transceivers. We have shown in the past that some engineered thermoplastic resins allow for producing micro-features into small parts, while maintaining micron-level tolerances. This is a requirement in many fiber optic devices. Most radio frequency modules would benefit from using thermoplastic for packaging, however a common problem with plastic is its lack of conductivity for shielding. We have demonstrated that metal coatings can be applied to plastic as a means of providing necessary shielding for EMI/RFI. We have made several key acquisitions and facility upgrades to improve our capability to deliver thermoplastic-based solutions to packaging-related problems typically associated with high cost, high weight materials such as glass, ceramic and kovar. In this paper we present a variety of examples of manufacturing methods common to the injection molding industry, but found within one technology company that has serviced the microelectronics packaging industry for years.|
|Scot MacGillivray, Business Development Manager
East Providence, RI