Here is the abstract you requested from the IMAPS_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|3M's Industry Leading High Speed Cable-to-Board Solutions|
|Keywords: Interconnect, Coax, Performance|
|3M Engineers have invented a simple high performance cable-to-board interconnect solution based on legacy 2mm Latch Eject Headers. This common footprint solution allows a Hardware Packaging Engineer to upgrade and change painlessly without a major circuit board change. The Systems Architect is allowed to tailor as-needed electrical performance up to 12 Gbps using the same 2mm family of products. The Components Engineer can simplify his options using a standard footprint for a wide variety of performance needs. This paper shows this new family of products along with supporting data to demonstrate performance and value. Electrical performance for legacy ribbon cable will be benchmarked with data. New interconnect art will be shown with the physical product changes along with increasing electrical performance stepping up to 6GHz/12 Gbps. Comparative impedance profiles, attenuation, eye patterns and crosstalk will be based on generous cable lengths of 12 inches. All interconnect systems discussed will be supported with data from a custom test board with 2mm spacing in a 2x10 signal array format. The varying cabling options will include micro-coaxial and micro-twinaxial.|
|Richard J. Scherer, Senior Product Development Specialist
3M Electronic Solutions Divsion (A142-3E-01)