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Low Thermal Expansion and High Heat Dissipation Printed Wiring Boards
Keywords: Carbon Fiber Reinforced Plastics, Low Thermal Expansion, High Heat Dissipation
Satellite power supplies are required to reduce in size and in weight. To fulfill the requirements it is indispensable to conduct surface mounting technology, in which the devices supplying high power with using large-scale ceramic packages are realized. The technology has been pursued to realize printed wiring boards (PWB) with high heat dissipation and low thermal expansion. However, conventional glass-epoxy and aluminum core PWB do not provide high heat dissipation and low thermal expansion, respectively, enough for realizing the reliable PWB. In this study, thus, we attempted to develop a new core part for PWB in order to overcome the above problems. The part developed was composed of two different kind of layers, which were made of CFRP (Carbon Fiber Reinforced Plastics) and alumina-epoxy resin compound, respectively. It was comfirmed that the part has lower thermal expansion than conventional glass-epoxy and aluminum core part. By applying the part thus developed to PWB, the heat dissipation of the PWB was higher than that using conventional aluminum. It is indicated that, furthermore, a crack was not observed by heat-cycle test, which is attributed to the optimal thermal expansion of the CFRP and alumina-epoxy resin compound. It has been demonstrated that the CFRP core PWB developed show higher heat dissipation and lower thermal expansion than the conventional PWB. The PWB developed is very useful for realizing satellite power supplies capable of reduction in size and in weight.
Sohei Samejima,
Mitsubishi Electric Corporation
Amagasaki, Hyogo 661-8661,
Japan


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