Here is the abstract you requested from the IMAPS_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Development of Thin LSI Embedded Circuit Board|
|Keywords: semi-additive circuit , thin LSI with carrier substrate , LSI embed|
|In recent years, highly efficient miniaturizations of electronics system are progressed remarkably in consumer electronics products, such as cellular phone and smart phone. Under these streams, passive device embedded printed circuit boards were already introduced in the cellular phone, as the solution for demands of camera module, to improve function without changing a form factor. Stream of electric module miniaturization promoted greatly using this passive embedding fabrication, based on process technology of printed circuit boards. We also already took passive parts embedded printed circuit board using conventional B2it (Buried bump interconnection technology) laminate technology in to the market. In this paper, we introduce active device embedding technology using newly developed thin packaging technology and simultaneous laminating process. Moreover, we introduce about the mechanical reliability of the printed circuit boards which embedding a thin package. Furthermore, potentials for practical use of newly developed thin and high pin count package embedded PCB is described using case studies of the electrical and thermal characteristics.|
|Shuji Sagara, Manager
Dai-Nippon Printing Co., Ltd.