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Micron Level Placement Accuracy Case Studies for Optoelectronic Components
Keywords: 1-3um Placement Accuracy, Laser Diode Eutectic Attach, VCSEL Epoxy Attach
Applications requiring ultra high placement accuracies of 1 to 3 um are surfacing in several optoelectronic applications such as Arrayed Laser Print Heads, P-Side-Down Laser Applications, and multi-channel optical communication products. An overview of the technology and the placement accuracy and attachment method drivers is presented for the three cases. With placement accuracies for surface mount machines typically 40um, 10um for die attach machines, and 1 um for ultra high accuracy placement machines, this paper will cover the differences in measurement, material, and process controls that are required to successfully achieve high placement accuracies of 1um to 3um.
Daniel D. Evans Jr., Senior Scientist
Palomar Technologies
Carlsbad, CA

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems