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Studying the Interactions between Mushroom-Type EBGs, Transmission Lines and Vias
Keywords: EBG, Modeling, mixed-signal
The continuous demand for multifunctional and portable microelectronic devices drives the integration of RF/analogue and digital components in a compact environment. However, the coupling of simultaneous switching noise (SSN), caused by digital circuits, to RF components may cause system malfunctioning. So far, electromagnetic bandgap (EBG) structures have proved to be very effective in providing a wideband solution in suppressing SSN. Consequently, interest and research on EBGs has grown exponentially within the last decade. But much of the research effort has concentrated in analyzing the filtering properties of EBGs, proposing novel techniques for extending their stop band bandwidth as well as proposing methods for efficient design and miniaturization. Very little effort has been dedicated to studying the interactions between EBGs and other packaging components such as transmission lines and vias. In this work, we designed and measured a mushroom-type EBG for blocking SSN from approximately 750 MHz to 3.2 GHz. Within this range, most of the wireless communication standards (e.g., GSM 800/900/1800/1900, WLAN, Bluetooth, etc.) exist. Furthermore, we studied the interactions between these EBGs, transmission lines and vias that are placed in close proximity to each other or are integrated together with the EBGs in the power distribution network. We realized that the number and position of the transmission lines and vias determine the effective change in capacitance and inductance of the cavity, which in turn determines the stopband characteristics of the EBG. Within the stopband, the EBG eliminates the cavity resonances which usually have a huge impact on the signal integrity characteristics of transmission lines and vias. These transmission lines and vias on the other hand cause a shift in the stopband of the EBG. Hence, the presence of these transmission lines and vias must be taken into account (right at the beginning of the design cycle), when designing EBGs. Originally sent to Design and Modeling.
Dr. Ivan Ndip, Research Engineer & Group Manager
Fraunhofer Institute for Reliability and Microintegration, IZM
D-13355 Berlin,
Germany


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