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Process Integrated Quality Control for Wire Bonding
Keywords: Wire Bonding, FPGAs, PiQC
The Process Integrated Quality Control (PiQC) system records all relevant signals for the wire bonding process from a transducer-integrated sensor, the ultrasonic generator and a deformation sensor. A quality index value from 0 to 100% is calculated based on 6 different input signals compared to 6 different reference curves. These values are recorded in real-time and statistically analyzed based on a mathematical model in the PIQC box a high speed computer utilizing FPGAs (field programmable gate arrays) in place of normal I/O boards and normal software code. Useful or necessary values such as mechanical oscillation, current, wire deformation and resonance frequency in addition to friction behavior are analyzed for evaluation of bond quality during the bond process. PIQC is an extensive quality control system where, for the first time ever in the industry, all physically relevant signals are subject to evaluation in real-time, resulting in a distinct quality index. The presentation will focus on 100% first pass yield, which continues to gain importance in wire bonding for both heavy and fine wire applications, with an increasing number of products focusing on zero yield loss. Achieving this measure of quality requires the consideration of every aspect of every wire bond connection. Along with the technical challenges presented by such quality targets, wire bonding equipment users must consider the increasing cost for more sophisticated and/or additional quality measurements.
Roberto Gilardoni, Sales Engineer
Hesse & Knipps, Inc.
Paderborn 33100,
Germany


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