Abstract Preview

Here is the abstract you requested from the IMAPS_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Packaging Technology for Recent Notebook PCs
Keywords: Packaging Assembly, PCs, Printed Wiring Board
There seems to be no end to the demands for weight saving and downsizing notebook PCs for portable usage. In order to achieve the criteria in the demands, we have applied the latest method. We introduce its printed wiring board and packaging assembly technology this time.
Ryou Kanai,
Fujitsu Advanced Technologies Limited
Nakahara-ku, Kawasaki 211-8588,

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems