Here is the abstract you requested from the IMAPS_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Study of Stress to Solder Joint by Underfill Filling|
|Keywords: Flipchip Interconnection , Solder Joint , Underfill|
|The effect of this non-homogeneous condition to the flipchip interconnection was examined.|
|Mr. Akira Tanaka ,
Toshiba Corporation Personal Computer & Network Company