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High Reliable Resin Core Bump Technology for 20um Pitch COG (Chip on Glass) Interconnection
Keywords: Resin Core Bump , COG, Au Bump
The Resin Core Bump technology is an innovative COG (Chip On Glass) technology. It has compatibility with conventional Au bump with ACF (Anisotropic Conductive Film) COG technology, fine pitch capability due to eliminating conductive particles from the bonding system, and superior reliability due to direct interconnection between bump and substrate electrodes. In this paper, we report reliability test result of 20m pitch interconnection. It showed stable and high reliable results.
Mr. Haruki Ito , Manager
SEIKO EPSON Corporation
Suwa-gun, Nagano-ken 399-0295,
Japan


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