Abstract Preview

Here is the abstract you requested from the IMAPS_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

High Reliable Resin Core Bump Technology for 20um Pitch COG (Chip on Glass) Interconnection
Keywords: Resin Core Bump , COG, Au Bump
The Resin Core Bump technology is an innovative COG (Chip On Glass) technology. It has compatibility with conventional Au bump with ACF (Anisotropic Conductive Film) COG technology, fine pitch capability due to eliminating conductive particles from the bonding system, and superior reliability due to direct interconnection between bump and substrate electrodes. In this paper, we report reliability test result of 20m pitch interconnection. It showed stable and high reliable results.
Mr. Haruki Ito , Manager
SEIKO EPSON Corporation
Suwa-gun, Nagano-ken 399-0295,

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems