Micross

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Here is the abstract you requested from the IMAPS_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Cooling Rate Dependent Underfill Fracture Toughness
Keywords: Underfill, Materials, Adhesives
Abstract to come. Added late after a withdrawal from Tom Lesniewski, Northrop Grumman.
Soojae Park, Engineer
IBM - T.J. Watson Research Center
Yorktown Heights, NY
USA


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