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Thermosonic Gold to Gold Flip Chip Bonding for Small Die High Density Interconnect
Keywords: Flip Chip Thermosonic Bonding, Gold to Gold Interconnect, Die Shear Strength
In this study the thermosonic flip chip bonding profile consisting of temperature, load, ultrasonic power, and time was investigated for small die attach. The study results show that temperature changes impact the bonding lattice which include elastic modulus, and tensile strength which results in different die shear strengths. In this study the heating was restricted to the bond tool tip to minimize temperature changes to the piezo transducer. Temperature changes will impact the impedance and dissipative ultrasonic energy of the piezo system. The study shows that thermosonic flip chip bonding parameters are influenced mutually. This study can help demine the flip chip bonding criteria and optimization using thermosonic GGI process.
Philip Couts, Engineer
TDK Corporation of America
Mount Prospect, IL
USA


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