Here is the abstract you requested from the rf_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Organic RF Air Cavity Semiconductor Packages|
|Keywords: Air Cavity Organic LCC, Open Cavity QFN, Organic Air Cavity Semiconductor Package|
|RF and wireless designers need quick-to-market solutions for low cost, air cavity semiconductor packages. The cost to spin new ceramic packages from scratch requires a large investment. Traditional air cavity packages using metal lead frames with injection molded cases take months to develop and are economical only for high volume applications. During the past decade, volume production has shifted to Southeast Asia and China, relegating North America, Japan and Europe to contend with R&D in a “high-mix, low volume” norm. RF grade organic air cavity packages can be produced at low cost, in days, rather than months using familiar PCB technology. Suitable RF grade copper clad organic substrates such as BT, Teflon, PTFE, LCP, polyimide and other composites are readily available. New composites with improved RF performance are continuously coming into the market. Experienced board shops are familiar with layer build up and cavity routing. Wire bondable air cavity packages can be constructed with as few as three metal layers. The addition of a fourth layer opens opportunities to produce QFN and organic LCC style stackable PoP (package on package). Organic air-cavity packages with low profiles, under 1.0mm thick are easily achievable. The purpose of this paper is to discuss the challenges and benefits of using easily understood PC board manufacturing processes to develop RF grade organic air cavity packages.|
|Martin Hart, President
Mirror Semiconductor, Inc.