Here is the abstract you requested from the rf_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Liquid Crystal Polymer for RF and Millimeter-Wave Multi-layer Hermetic Packages and Modules|
|Keywords: Liquid Crystal Polymer, Embedded Passives, Package Feedthroughs|
|We present the design and development of multi-layer organic modules and packages using liquid crystal polymer (LCP). An overview and unique properties of liquid crystal polymer will be discussed. We will present the development of lamination processes that seal an LCP lid onto a package base. These processes are used to develop surface mount packages that have a fine leak rate of ~3x10-8 cc-atm/s. We will present the electrical characteristics of band pass package feedthroughs, embedded passive components, and communications modules in millimeter wave frequencies. We will also demonstrate that the LCP packages can withstand 1500 hours of 85/85 and > 100 temperature cycles.|
|Mark P. McGrath, Research Assistant