Micross

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Liquid Crystal Polymer for RF and Millimeter-Wave Multi-layer Hermetic Packages and Modules
Keywords: Liquid Crystal Polymer, Embedded Passives, Package Feedthroughs
We present the design and development of multi-layer organic modules and packages using liquid crystal polymer (LCP). An overview and unique properties of liquid crystal polymer will be discussed. We will present the development of lamination processes that seal an LCP lid onto a package base. These processes are used to develop surface mount packages that have a fine leak rate of ~3x10-8 cc-atm/s. We will present the electrical characteristics of band pass package feedthroughs, embedded passive components, and communications modules in millimeter wave frequencies. We will also demonstrate that the LCP packages can withstand 1500 hours of 85/85 and > 100 temperature cycles.
Mark P. McGrath, Research Assistant
UC Davis
Davis, CA
USA


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