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Ceramic Systems in Package for RF and Microwave
Keywords: LTCC, system in package, RF-MEMS
RF-PLATFORM is combining a wide field of R&D activities with a consolidated service action. The partners in the consortium investigate different technologies, develop applications and perform multi project wafer production runs consisting of numerous structures each technology. The network is open for interested parties, who can join a user club and participate in the MPWs. Ceramic multilayers are known as very universal PCBs and packages with advanced properties, 3-dimensional functionalities, good RF performance or integration of passives. One of the main technological challenges in RF-Platform is the development of systems-in-package for a couple of RF applications. Since LTCC as a highly reliable ceramic interconnection technology enables an increased circuit density and an advanced versatility of functions, it acts as the carrier for the electrical wiring and packaging, contains buried components and structures, waveguides and antenna structures and is last but not least the case for the system with the opportunity of hermetic encapsulation. Partner EADS has developed an 35 GHz LTCC patch antenna module for communication links, steerable by RF-MEMS switches being integrated directly in the system. Additional applications are a 24 GHz sensing system and a radar sensor module in the 79 GHz range. The paper will give an overview about investigations, simulations and measurements performed with the test vehicles and intermediate structures being manufactured in different MPW runs. The European Commission is supporting the project in the 6th framework programme.
Thomas Bartnitzek, R & D Manager
VIA Electronic GmbH
Hermsdorf, Thuringia 07629,

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