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Lead Free SMT Assembly Qualification for Stack MicroVia Boards.
Keywords: SMT, Lead Free, Stacked Via
Lead Free SMT Assembly poses many challenges for process optimization in high volume manufacturing. Migration to lead free assembly requires careful balancing of Bill of Materials with reflow profile. Double sided SMT assembly requires balancing of delta T for Side A and Side B reflow. Evaluation of microvia connections, solder joint integrity of Ball Grid Array ,SMT packages, and passives is essential to ensure a reliable assembly. Approved rework processes are critical for assembly integrity. This paper summarizes the results of X-sectional analysis, shear testing and thermal shock / temp. humidity testing of lead free assemblies using HDI( High Density Interconnect) board.
Mumtaz Y. Bora, Principal Quality Engineer
Kyocera Wireless Corp.
San Diego, CA
USA


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