Here is the abstract you requested from the rf_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|An Innovative Multilayer QFN|
|Keywords: QFN, BGA, Thermal|
|Driven largely by the increasing need for smaller packages in the wireless handset market, QFN (Quad Flat No-Lead) delivers a number of advantages as it offers generally a smaller form factor than other leaded devices and the center pad provides better grounding and thermal properties. However, as the QFN mechanical structure makes it difficult to accommodate multiple chips and passive components assembly, the industry is inclined to stay with laminate type packages as a trade-off. This could result in potential lost opportunities for QFN packages as passive assembly capability is a much needed requirement in many RF / wireless applications. The innovative multilayer QFN from Bridge provides an excellent solution to achieve passive assembly capability without compromising the thermal and electrical benefits of QFN. Specifically, this thermally enhanced interposer is manufactured by integrating conventional BGA substrate and etched QFN lead frame technology to allow higher design flexibility in accommodating multiple dies and passive assembly, and maintaining exposed die paddle to effect ground connection & facilitate heat dissipation.|
|Dr. Charles Lin, CEO
Bridge Semiconductor Corporation
Taipei, Taiwan 112,