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Leadless Ceramic SMT Substrates and Packages from DC to 30GHz
Keywords: Leadless Ceramic SMT, Substrates and Packages, DC to 30GHz
Leadless ceramic packages, chip carriers and substrates using PCTF (Plated Copper on Thick Film) technology provide a cost effective solution for challenging task of packaging at bandwidths from DC to millimeter-wave. Package construction and material system for hermetic and non-hermetic SMT packages for direct PCB mount (to 1.0 in size) are described. Technical and commercial advantages and benefits of PCTF packaging approach for active and passive components and modules are listed in details with electrical and thermal performance of the various products. Case studies for a number of applications are presented. A compact hermetic package for 5 W HPA, 10 W two stage GaN amplifier, a family of LNAs, 10 GHz encoder, 6 GHz bandpass filter, an SMT transmitter module for the RFID tag and DC to 20 GHz QFN compatible ceramic package are amongst these examples. Presented test data demonstrates low insertion loss, good return loss, excellent thermal management and improved reliability from DC to 30 GHz.
Nahum Rapoport, President
Remtec Inc.
Norwood, MA
USA


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