Here is the abstract you requested from the rf_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Leadless Ceramic SMT Substrates and Packages from DC to 30GHz|
|Keywords: Leadless Ceramic SMT, Substrates and Packages, DC to 30GHz|
|Leadless ceramic packages, chip carriers and substrates using PCTF® (Plated Copper on Thick Film) technology provide a cost effective solution for challenging task of packaging at bandwidths from DC to millimeter-wave. Package construction and material system for hermetic and non-hermetic SMT packages for direct PCB mount (to 1.0” in size) are described. Technical and commercial advantages and benefits of PCTF packaging approach for active and passive components and modules are listed in details with electrical and thermal performance of the various products. Case studies for a number of applications are presented. A compact hermetic package for 5 W HPA, 10 W two stage GaN amplifier, a family of LNA’s, 10 GHz encoder, 6 GHz bandpass filter, an SMT transmitter module for the RFID tag and DC to 20 GHz QFN compatible ceramic package are amongst these examples. Presented test data demonstrates low insertion loss, good return loss, excellent thermal management and improved reliability from DC to 30 GHz.|
|Nahum Rapoport, President