Here is the abstract you requested from the rf_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Enhanced High Frequency LTCC for RF and Microwave Packaging|
|Keywords: LTCC, processing, tape|
|More than one million low loss electronic packages have been produced using Ferro A6M LTCC over the past 20 years. While the high frequency properties of this LTCC are excellent for many applications due to its low relative permittivity and extremely low tangent delta over a wide frequency range, processing of A6M has often proven challenging due to the nature of the unfired tape properties. Punching, handling, lamination and cutting are a few of the processes that have limited the ease of high volume manufacturing of this material and therefore limited its usage. Recent work at Ferro Electronic Materials has resulted in a new LTCC product that maintains all the desirable high frequency properties of A6M while putting the material into a form suitable for high volume manufacturing processes. Tape tensile strength has been improved by more than 9X. Cutting properties of the tape have been improved dramatically, allowing clean and near net size cutting of laminates to be accomplished in the green state. Easier and higher laminate density has been demonstrated, allowing for wider process windows and lower part shrinkage during the firing process. These changes are considered significant keys to high yield processing of high technology LTCC products. Excellent electrical properties have been demonstrated with this product, with values comparable to the standard A6M product. It is believed that these improvements should remove one of the key barriers to wider use of low loss LTCC in high volume manufacturing of critical products used in high frequency packaging.|
|Ed Graddy, R&D Manager