Here is the abstract you requested from the rf_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Reliability of Lead-Free and Tin-Lead Solders for PBGA Assemblies|
|Keywords: lead free solder, tin-lead solder, BGA|
|IPC 97xx covering surface mount assembly reliability for both thermal and mechanical testing requirements are now well adopted by industry and widely referenced. The status of these specifications are reviewed and discussed. Specifically, IPC-9701 specification addresses how thermal expansion mismatch between the package and the PWB affects solder joint reliability. Since release of its new revision that includes Pb-free solder, additional data have been gathered to determine the impact of various thermal cycle parameters on accelerated test results. Industry/JPL test data for a high I/O plastic package assembled using pb-free and tin-lead solder alloys. Effect of various parameters including type of solder materials, reflow maximum temperature, dwell time, and monitoring techniques are discussed in details. Results of JPL data performed under three different thermal cycles one cool down to -130?C also presented.|
|Reza Ghaffarian, Principal Engineer
Jet Propulsion Laboratory, California Institute of Technology