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Low-Cost High-Bandwidth Millimeter Wave Leadframe Package
Keywords: MMIC, Packaging, high-bandwidth
As integrated circuit speeds and bandwidth needs increase, low-cost packaging and interconnect technologies continue to be a challenge. Solutions to these problems are driven by consumer’s desire for increasing bandwidth, such as in portable communications applications, and manufacturers’ desire to drive down systems cost, to take advantage of volume manufacturing processes. This paper describes a low-cost plastic QFN package possible of meeting these needs. This package has low-loss, high-bandwidth and is based around MicroCoax interconnect technology. Since this package structure is broadband, it will easily allow for a variety of chipsets to be built using the same process sequence and I/O configuration, eliminating costly overhead. With less than 0.5dB insertion loss and >15dB return loss per RF interconnect at 50GHz, this 5x5mm QFN package will allow bare die only applications to enter the world of high-speed PCB assembly, significantly driving down the cost of high-frequency RF subsystems. Process technology, I/O performance, active device performance, PCB board material selection and test protocol will all be discussed.
Eric A. Sanjuan, Manager, Advanced Technology
BridgeWave Communications, Inc.
Santa Clara, CA

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