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High Frequency Packaging of RF Devices
Keywords: RF Packaging, MW Packaging, Plastic Packages
The packaging of high speed devices (> 15Ghz) requires materials and design techniques, that allow for products not just meeting electrical and RF performance criteria, but which can also meet demanding reliability performance and manufacturing constraints. For the most part there have been limited materials used for high frequency RF packaging, which have included mostly ceramic and metals, and some exotic organic materials. Ceramic and metals have worked well from a performance viewpoint, but are expensive and fail to meet cost targets. Organic materials such as PTFE based substrates have been problematic due to reliability expectations and manufacturability. Other organic substrates (eg) polyimide have limitations with respect to environmental issues such as moisture absorption. QLP has developed a new polymer (QuantechTM) which is currently being commercialized for air cavity packages such QFNs, LDMOS and custom packages designed for both commercial and military applications. Characteristics of this material include extremely low moisture absorption, ability to tailor mechanical properties such as CTE and stiffness, low dielectric and loss properties, and extremely stable performance through high frequency ranges. The next step in the evolution of this material is utilizing QuantechTM as a dielectric material for interconnect. QLP is developing this material into high frequency laminate applications, and integrating this multilayer structure into RF packages which can satisfy performance, cost, and manufacturability goals for the next wave of high frequency applications. This talk will focus on QLP materials technology, and specifically material properties as it relates to RF performance. We will present current packaging applications, and our roadmap to high frequency multilayer applications.
Dr. Mike Zimmerman, Chief Technology Officer
Quantum Leap Packaging, Inc.
Wilmington, MA
USA


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