Abstract Preview

Here is the abstract you requested from the rf_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Millimeter-Wave Radio System In A Package
Keywords: Milimeter wave, SIP, Radio
The thirst for higher data rates and more bandwidth has resulted in increased interest in millimeter-wave systems as a means for local and wider area information transport. At the same time there is a real need to lower cost and more compact systems. These requirements have lead to the development of a highly integrated millimeter-wave System In a Package (SIP) which operates beyond 40GHz. This solution uses low cost ceramic packaging and optimized interconnects and transitions to allow for wide band electrical performance. This paper will present details on the functionality, electrical performance and packaging used to realize this solution.
Rick Sturdivant, President
Microwave Packaging Technology, Inc.
Placentia, CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic