Here is the abstract you requested from the Thermal_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Materials and Substrates for LED Thermal Management|
|Keywords: Thermal interface materials, LEDs, Thermal management|
|Light emitting diodes are finding increasing usage in various applications - household, commercial, signage, automotive, and backlighting to name a few. The trend is only going to intensify in future – creating demands for a variety of packaging for LEDs and LED based products. The heat transfer characteristics of these various package designs will determine not only the long-term reliability of LEDs, but also affect the stability of light output and color response. In this presentation we will identify thermal challenges associated with LED packaging from die/LED package level, to circuit/board level. In addition we will propose various thermally conductive materials solutions for these thermal challenges with working examples, and/or models and address processing and manufacturability.|
|Justin Kolbe, Sr. R&D Engineer
The Bergquist Company