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Materials and Substrates for LED Thermal Management
Keywords: Thermal interface materials, LEDs, Thermal management
Light emitting diodes are finding increasing usage in various applications - household, commercial, signage, automotive, and backlighting to name a few. The trend is only going to intensify in future creating demands for a variety of packaging for LEDs and LED based products. The heat transfer characteristics of these various package designs will determine not only the long-term reliability of LEDs, but also affect the stability of light output and color response. In this presentation we will identify thermal challenges associated with LED packaging from die/LED package level, to circuit/board level. In addition we will propose various thermally conductive materials solutions for these thermal challenges with working examples, and/or models and address processing and manufacturability.
Justin Kolbe, Sr. R&D Engineer
The Bergquist Company
Chanhassen, MN
USA


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